On January 6th, Beijing time, CES 2016 International Consumer Electronics Show officially kicked off in Las Vegas, USA. Domestic manufacturer LeTV also participated in the exhibition and will hold a new product launch. Before the press conference, there were a lot of rumors that LeTV will release the first smartphone equipped with Qualcomm Snapdragon 820 processor, and the result is exactly the same as the rumor. LeTV's new flagship model Max Pro was officially unveiled at this CES conference! Le Max Pro is equipped with Qualcomm's new Snapdragon 820 flagship processor, becoming the world's first smartphone with this processor. It adopts 6.33 inch resolution as 2K screen, 4GB RAM+64GB ROM storage combination, 4 megapixel front + 21 million pixel rear camera combination, supports OIS optical image stabilization, and still uses USB type-c interface to support VoLTE. Adopting a new generation of 802.11ad WiFi technology, it is the world's first smartphone to support tri-band WiFi. The most eye-catching is the black technology on the Max Pro - ultrasonic fingerprint recognition technology (new features in the Snapdragon 820 processor), which can solve the problem of water or oil on the finger. The problem of not recognizing the situation is a very good experience. This technology is also the first commercial use. From the perspective of the real machine, Le Max Pro is very similar in appearance to Le Max, and there is basically no change except for a slight difference in the fingerprint recognition area of ​​the back. As for the price and time to market, LeTV did not elaborate. The news in this regard may be answered in the follow-up domestic conference. So far, the first battle of Qualcomm Snapdragon 820 has finally come to an end. Interested machine friends may wish to pay attention to the follow-up reports of LeEco. 11mm and 3mm Spring Steel Wire,compression spring,tension spring,torsion spring,wire forming Yixing Steel Pole International Trading Co., Ltd , https://www.yx-steelpole.com