In recent years, green energy conservation has become the theme of development. Today's world is constantly seeking more efficient and energy-saving light sources as a substitute for traditional lighting sources. LED light source is the best choice, followed by the application of high-brightness LED in lighting field in recent years. Continued and rapid expansion. The introduction of the laser wafer dicing process in LED manufacturing has led to the extensive use of LED backlights in mobile phones, televisions, and touch screens, and the most exciting use of white LEDs in lighting. The scribe line of the laser dicing LED is much narrower than the conventional mechanical scribe, so the material utilization rate is significantly improved, thus improving the output efficiency. In addition, laser processing is a non-contact process. The dicing causes wafer microcracks and other damage to be smaller, which results in tighter wafer granules, high output efficiency, high productivity, and improved reliability of finished LED devices. . LED laser dicing features Single crystal sapphire (Sapphire) and gallium nitride (GaN) are hard and brittle materials (tensile strength close to steel), so it is difficult to cut into individual LED devices. When cutting these materials with a conventional mechanical saw blade, it is easy to cause damage such as wafer chipping, microcracking, delamination, etc., so the LED wafer is cut with a saw blade, and a wide width must be reserved between the monomers to avoid cracking and cracking. Injury to LED devices, which greatly reduces the efficiency of LED wafers. Laser processing is non-contact processing. As an alternative to traditional mechanical saw blade cutting, the laser dicing slit is very small. The focused laser light spot acts on the surface of the wafer, rapidly vaporizing the material, and manufacturing very much between the active areas of the LED. Tiny cuts allow more LEDs to be cut on a limited area of ​​wafer. Laser dicing is especially good for gallium arsenide (GaAs) and other brittle compound semiconductor wafer materials. Laser processing of LED wafers, the typical dicing depth is 1/3 to 1/2 of the thickness of the substrate, so that the segmentation can obtain a clean fracture surface, and the production of narrow and deep laser scribe cracks while ensuring high-speed dicing Speed, which requires the laser to have excellent quality such as narrow pulse width, high beam quality, high peak power, and high repetition rate. Not all lasers are suitable for LED dicing because of the transmission of the wafer material to visible wavelength lasers. GaN is transmissive for light with wavelengths less than 365 nm, while sapphire wafers are semi-transmissive for lasers with wavelengths greater than 177 nm, so three- and four-fold Q-switched all-solid-state lasers (DPSSL) with wavelengths of 355 nm and 266 nm are LED crystals. The best choice for round laser dicing. Although excimer lasers can also achieve the wavelengths required for LED dicing, frequency-doubled all-solid-state Q-switched lasers are smaller, require less maintenance than excimer lasers, and in terms of quality, fully solid-state laser scribe lines Very narrow, more suitable for laser LED dicing. Laser dicing greatly reduces wafer microcracking and microcrack expansion, and the distance between LED cells is closer, which improves both production efficiency and productivity. In general, a 2-inch wafer can separate more than 20,000 LED single-element devices, so the slit width of the cut can significantly affect the number of splits; reducing the long-term reliability of the micro-cracks for the post-divided LED devices There will be a noticeable improvement. Compared with the traditional blade cutting, the laser dicing not only improves the output efficiency, but also increases the processing speed, avoids the processing defects and cost loss caused by the blade wear. In short, the laser processing precision is high, the processing tolerance is large, and the cost is high. low. to sum up: As the lighting market continues to grow, the LED manufacturing industry is increasingly demanding both capacity and yield. Laser dicing technology will become a commonly used technology in the LED manufacturing industry, and even become the industry standard for high-brightness LED wafer processing.
Traditional solar system includes so many parts: traditional lamp ( or LED lamp), Solar Panel, lead-acid battery, controller, solar panel brackets, battery cabinets. The volume is very large, therefore freight charge is very high, and labor cost of mounting is also very high. But Ruifeng`s Solar Smart integrated solar LED Street Lights solve all the above problems and troubles. Ruifeng has designed and developed a unique [SolarSmart"-all in one Integrated solar street lighting module, Fit and Forget built with intelligent Microcontroller charge controller system, comprising High Efficiency 12W Integrated Solar Street Lights 12W Integrated Solar Street Lights,12W Solar Street Lights,Solar Led Street Light,Solar Street Lamp Yangzhou Bright Solar Solutions Co., Ltd. , https://www.solarlights.pl.jpg)