According to the safe landing of Xinhua News Agency with the return of the Shenzhou 11 spacecraft on the 18th, it marked the successful completion of the manned missions of Tiangong 2 and Shenzhou 11. The Beijing Aerospace Flight Control Center successfully broke through five key technologies in this mission, providing a strong guarantee for mission success. First, high-precision medium and long-term orbit determination technology. The Tiangong No. 2 rendezvous and docking track is 393 km. It is necessary to carry out orbit maintenance 21 days before the launch of the spacecraft, taking into account the phase adjustment, rounding and orbital height control, and put forward new requirements for the accuracy of long-term orbit prediction. The center uses the Tiangong-1 “393 10km orbit determination and forecast†to expand the orbital measurement data obtained by the experiment, and effectively improves the accuracy of the orbit prediction by refining the Tiangong No. 2, the atmospheric density estimation and the spatial environment parameter application strategy optimization. . The second is the design and verification technology of the 393 track telecontrol strategy. The Shenzhou 11 spacecraft needs to have the ability to rendezvous and dock on a larger scale. Due to the different initial phases and different orbital heights, the center redesigned the ground guidance control strategy, verified the track and control accuracy, optimized the implementation process, and re-established the corresponding emergency control strategy. The third is the high-precision short arc segment rapid measurement rail technology. The time interval between the fifth control of the long-distance guidance of Shenzhou 11 and the first pulse control of the autonomous guiding section is only 2 laps, and the orbital time is only 1 lap, which puts higher requirements for the accuracy of short-arc alignment. To this end, the center has been carrying out the orbital accuracy analysis and target simulation since the end of 2014. Through the optimization of algorithms, construction models, compression processes and other links, the company has developed a high-precision short-arc rapid measurement rail technology to ensure the task. The smooth implementation of the medium and long distance guidance control. The fourth is the fast track control technology before returning. In order to verify the spacecraft's rapid orbit control capability and optimize the return and re-entry quality of the spacecraft, the orbit before the spacecraft returns to maintain the control mode of two orbits within one circle. The fifth is the companion star observation and resident orbit control technology. In the operational phase of the assembly, the center controls the companion star to achieve the test of the overflying observation assembly. At the same time, it also needs to implement complex type control such as capture point capture, hold, and transfer. The accuracy of the dwell and fly-by track is high. The center comprehensively analyzes the influencing factors such as control error, atmospheric density and orbital attenuation, and designs algorithms such as satellite fly-by observation, dwell point capture, and dwell point movement reconstruction to achieve high-precision orbit control. Schematic diagram of the successful landing of the Shenzhou 11 spacecraft return capsule
1.ANTENK Wire to Board connectors are avialable in different terminations and sizes intended for use on a variety of applications. These connectors provide power and signal with different body styles, termination options, and centerlines. To find the wire to board set required, click on the appropriate sub section below.
2.Our products are widely used in electronic equipments,such as monitors ,electronic instruments,computer motherboards,program-controlled switchboards,LED,digital cameras,MP4 players,a variety of removable storage disks,cordless telephones,walkie-talkies,mobile phones,digital home appliances and electronic toys,high-speed train,aviation,communication station,Military and so on
Antenk Wire To Board Connectors Ranges:
Power Wire to Board
Wire to Board Connectors Information Wire To Board Connectors,Wire Harness,Pcb Wire To Board Connector,Pin Wire To Board Connector,IDC Wire to Board,Locking Wire to Board,Latching Wire to Board,Fine Pitch Wire to Board ShenZhen Antenk Electronics Co,Ltd , https://www.atkconnectors.com
IDC Wire to Board
Locking Wire to Board
Latching Wire to Board
Fine Pitch Wire to Board
Description
Wire-to-board connectors are used to interconnect printed circuit boards (PCBs) by using connectors attached to wires.
Specifications
Specifications for a wire to board connector include the following.
Wire-entry angle - There are three wire-entry angle styles: vertical, right-angle, and bottom-entry.
Wire size - Wire size is usually measured in American wire gauge (AWG), a standard for non-ferrous wire conductor sizes. The term "gauge" refers to the wire`s diameter. The higher the gauge number, the smaller the diameter and the thinner the wire.
Circuits or positions - With wire to board connectors, the number of circuits or positions may range from 1 to 120.
Pitch or center spacing - Pitch or center spacing is measured in millimeters (mm) or inches.
Lock to mating style - There are three basic lock-to-mating styles: positive, friction, and friction ramp.
Maximum current - The maximum current or current-carrying capacity is measured in amperes (A) and ranges from 1.0 A to 50. A.
Termination Methods
Crimp is the physical compression of a contact wire around a conductor to make an electrical and mechanical connection. Insulation displacement connectors (IDC) slice through the cable insulation to make a connection. Choices for termination method also include cage clamp, screw, tabs, and solder cups.
PCB Mounting Styles
With wire to board connectors, there are four choices for PCB mounting.
Through-hole technology (THT) mounts components on a PCB by inserting component leads through holes in the board and then soldering the leads in place on the opposite side of the board.
Surface mount technology (SMT) adds components to a PCB by soldering component leads or terminals to the top surface of the board. SMT components have a flat surface that is soldered to a flat pad on the face of the PCB. Typically, the PCB pad is coated with a paste-like formulation of solder and flux.
Press-fit and compression-style Board To Board Connectors are also commonly available.Wire to Board Connectors Information
Standards
Wire-to-board connectors carry approvals from various national and international organizations. In North America, they often bear marks from Underwriters Laboratories (UL) and/or the Canadian Standards Association (CSA).
A wire to board connector for the European marketplace should comply with the Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) directives from the European Union (EU). Wire-to-board connectors that comply with other requirements are also available.
BS 9526 N0001 - Specification for multi-contact edge socket electrical connectors.