January 09, 2025

Molex updates DDR4 DIMM socket

Molex now offers DDR4 DIMM sockets in both pneumatic and standard versions, giving design engineers more options and higher performance while remaining cost competitive. Pneumatic socket products feature through-hole termination types and streamlined latches and housings for better airflow and space savings. The standard models feature three termination types: crimp-on for solderless processes; simplified printing The type of surface mount for circuit board (PCB) traces; and the type of vias used for cost-effective applications.

All Molex DDR4 DIMM sockets meet JEDEC specifications and support UDIMM, RDIMM, and LRDIMM memory applications, designed for data, computing, telecom, and network servers with higher data rates and lower operating voltages than DDR3 memories. These sockets also use innovative moisture- and high-temperature nylon with a thermal expansion coefficient for high temperature processing operations.

Poox WaiKiong, global product manager at Molex, said: "Customers are equipped with enterprise-class server systems in order to find interconnect solutions that provide design flexibility and cost savings while maintaining the reliability of 24 hours of operation with virtually no failure. With different types of products that reduce connector footprint to increase PCB space, Molex achieves superior electrical performance over DDR3 to meet different customer needs. Our products use innovative manufacturing materials to help significantly reduce Small yield loss for more cost savings and faster delivery."

Crimp-type DDR4 DIMM sockets provide a lower cost cleaning and solderless process operation, eliminating thermal cycling that can cause stress on the PCB or degrade the performance of electronic components. All connectors benefit from an ergonomically designed socket latch for increased usability and powerful protection against high tearing and vibration. The double-ended leads on the socket allow the module to be inserted smoothly, while the studs on the substrate simplify solder joint inspection, measurement and rework. Shaped contact terminals prevent contact breakage and reduce stress on the housing during terminal insertion, while providing high connector durability and support up to 25 plug cycles. These socket products also have a smaller pitch (0.85 mm) than DDR3 sockets and show excellent compatibility in lead-free and halogen-free processing technologies.


Molex offers 0.76 and 0.38 μm gold-plated DDR4 DIMM socket products that combine a variety of housing and latch colors, PC tail length and PCB thickness. For more information, please visit the company's website at http://?key=ddr4_dimm_sockets&channel=products&chanName=family&pageTitle=Introduction&utm_source=prssorch&utm_medium=prrelease&utm_campaign=data&WT.mc_id=A02658. For information on Molex's other products and industry solutions, please subscribe to the Molex Newsletter at

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