Recently, Vishay Intertechnology, Inc. (NYSE: VSH) announced the launch of its new surface mount TMBS Trench MOS barrier Schottky rectifier family in the SlimDPAK (TO-252AE) package of the eSMP series. The Vishay General Semiconductor rectifiers are thinner than other DPAK (TO-252AA) packages and offer better heat dissipation, reverse voltages from 45V to 150V, reduced forward voltage and high current ratings. This article refers to the address: http:// The 40 Schottky rectifiers released today combine the advantages of TMBS technology and SlimDPAK packages. The single-die structure has a current rating of 35A and a dual-die common cathode structure with a current rating of 40A. The device's PCB footprint is the same as the DPAK package, and its package height is 43% lower, allowing engineers to design ultra-thin industrial and consumer electronics. In addition, the device's heat dissipation area is 14% larger, reducing the typical thermal resistance to 1.5 °C / W. The forward voltage of the new rectifier is reduced to 0.44V, 0.46V and 0.49V at 20A, 35A and 40A, which effectively reduces power loss and improves efficiency in DC/DC converters, freewheeling diodes and polarity protection diodes. The new rectifiers are also available in AEC-Q101 certified versions for automotive applications. The new rectifier has a maximum operating junction temperature of +175°C, MSL moisture sensitivity level of J-STD-020, and LF maximum peak of +260°C. The device meets the requirements of the automatic placement process, is RoHS compliant, and is halogen free. Samples and production quantities of the new TMBS rectifiers are available now, with lead times of twelve weeks for larger orders. Dongguan Metalwork Technology Co., LTD. , https://www.diecast-pro.com